Assembly and Reliability of Lead-Free Solder Joints
€ 185,90
Informação do Produto
| ISBN | 9789811539190 |
|---|---|
| Autores | John H. Lau, Ning-Cheng Lee |
| Editora | Springer Verlag, Singapore |
| Formato | Capa dura |
| Número de páginas | 527 |
| Peso (kg) | 1,034 |
| Data de Publicação | 30/05/2020 |
| Preço (iva excl.) | € 175,38 |
| Imposto | € 10,52 |
| Preço (iva inc.) | € 185,90 |
| Disponibilidade | 1 unidade em armazém externo |
Descrição do Produto
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.